管芯焊接[连接]，小片结法

芯片焊接

bid bond───[金融]押标金；[金融]投标保证金；履约保证金

in bond───（进口货物）在关栈中；[税收]保税

dative bond───配价键

indie band───独立乐队

bail bond───[法]保释保证书

bid bonds───[金融]押标金；[金融]投标保证金；履约保证金

clip bond───夹式键合

Figure 2 illustrates the fundamental aspects of a die bond.───图2所示为管芯连接的基本结构。

of MOSFET is consisted of five main processes, which are wafer sawing, die attach, wire bond, molding, trim and form.───MOSFET的封装主要由晶圆切割，晶粒黏贴，焊线，封塑，切割成型这五大流程组成。

In this paper, an improvement example of die shear strength and bond strength of a microwave module is introduced.───本文介绍了某微波组件芯片剪切力和键合强度的改进案例。

• diet pill
• dien vien puka
• die c
• dietary need crossword
• die of
• diethylamine bp
• diet pepsi
• die sinking process
• die light
• die to me
• die me die
• dielectric constant for water
• diesel generator
• die bond
• die fordwh te
• die with
• die of illness
• die metake more
• dietetics rdn
• diet food
• dietetics careers